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Director of Module Development

Xscape Photonics Inc, santa clara, ca, United States


We’re looking for a senior leader to drive Module Development for next-generation ELSFP external laser modules. This person will own the full development of highly integrated modules that bring together PCB electronics, photonics, packaging, and thermal design into a product that can scale in manufacturing.

The role requires leading cross-functional engineering teams to deliver high-performance, low-noise, and thermally stable laser modules from early concept through volume production, while also shaping the architecture and development path for future generations.

Key Responsibilities

  • PCB design for laser drivers, TEC control, and monitoring circuits
  • Optical subassemblies and laser integration
  • Mechanical packaging and thermal design
  • Define overall module architecture and make design trade-offs across performance, cost, power, and manufacturability
  • Drive tight optical, electrical, and thermal co-design within ELSFP constraints

Engineering Leadership

  • Build and lead a multidisciplinary module development team across:
  • PCB / electronics
  • Mechanical / thermal engineering
  • Test and validation
  • Set technical direction, lead design reviews, and maintain a high bar for execution
  • Establish strong practices for design, integration, debug, and validation

Execution & Delivery

  • Drive development from prototype through qualification (EVT/DVT/PVT) and production ramp
  • Partner closely with TPM and operations to deliver on schedule
  • Own key module metrics including noise, stability, yield, reliability, and cost
  • Oversee development of low-noise, high-performance PCBs that are critical to laser stability
  • Ensure strong power integrity, signal integrity, and EMI performance
  • Guide integration of:
  • TEC controllers and thermal feedback loops
  • Photodiode sensing and control systems

Manufacturing & Supply Chain

  • Define module assembly flow, test strategy, and calibration processes
  • Work closely with CMs, ODMs, and suppliers on:
  • PCB fabrication and assembly
  • Laser and optical component sourcing
  • Module packaging and alignment
  • Drive DFM/DFT, yield improvement, and cost reduction

Reliability & Quality

  • Ensure compliance with reliability and qualification requirements
  • Lead failure analysis and root-cause resolution across module and PCB-related issues

Required Qualifications

  • BS or MS in Electrical Engineering, Photonics, Physics, or a related field
  • 12–15+ years of experience in optical modules or other complex hardware systems
  • 5+ years of leadership experience in module, subsystem, or product development
  • Strong technical depth in:
  • Module and system integration
  • Proven track record of bringing hardware products into volume production

Preferred Qualifications

  • Experience with ELSFP, QSFP-DD, CFP2, or similar optical modules
  • Background in tunable or coherent laser systems
  • Familiarity with:
  • TEC-based thermal control
  • Optical packaging and alignment
  • Stabilization control loops and supporting firmware
  • Experience working in startup or fast-scaling environments

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