Process Integration Engineer (Writer) (49947)
Headway Technologies, Milpitas, CA, United States
Title
PROCESS INTEGRATION ENGINEER (WRITER)
FLSA Status
EXEMPT
Reports To
MANAGER, WRITER INTEGRATION
Summary
Under the direction of the Sr. Director of Process Characterization/NPI, the Process Integration Engineer (Writer) is responsible for the process integration and characterization of prototype wafers for new technology programs and next generation projects, including performing wafer level process characterization, conducting failure analysis on prototype wafers and recommending corrective action, and reviewing, monitoring, and analyzing backend performance data. This position is located in Milpitas, California.
Essential Functions
Develops and delivers process integration and characterization techniques for new technology programs and next generation products
Conducts failure analysis on newly developed processes and recommends corrective action if necessary
Participates in characterization or integration projects of various scope and complexity; ensures they are completed within the established timeframe
Performs wafer level process characterization on thin film recording heads using Focused Ion Beam (FIB) tool to identify defects and recommends corrective action
Reviews and analyzes backend performance data and makes recommendations to improve performance
Designs and conducts experiments to verify process robustness; analyzes data and reports findings
Analyzes data using JMP, MS Visual Basic, or similar software application to determine the root cause of process variations; develops charts or reports and presents findings before groups or teams
Responds to inquiries from other team members, managers, or departments
Adheres to all safety policies and procedures as required
Performs other duties of a similar nature or level
Qualifications
Minimum Qualifications
Bachelor’s degree in Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s or PhD degree preferred
Six years of hands‑on experience working in the process integration or characterization in a semiconductor environment in a manufacturing or process engineering role
Hands‑on experience using JMP or similar analytical application
Proficient in the use of Microsoft Office Applications
Required Knowledge, Skills, And Abilities
Knowledge of process integration and characterization principles, practices, and techniques
Knowledge of magnetic recording head or HDD manufacturing
Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
Able to design experiments, analyze results, and recommend corrective action
Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
Able to work productively and collaboratively with all levels of employees and management
Able to comply with all safety policies and procedures
Able to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements
Demonstrated analytical skills
Demonstrated organizational and time management skills
Demonstrated problem‑solving and troubleshooting skills
Flexible and able to prioritize
The annual rate for this full‑time position is between $121,000.00-160,000.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual pay range shown is subject to change and may be modified periodically.
Working Conditions
The Process Integration Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time‑to‑time to meet business or operational needs; may travel from building to building as needed. Also works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, twists, and crawls. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally push, pull, or lift up to 20 pounds.
Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.
#J-18808-Ljbffr
PROCESS INTEGRATION ENGINEER (WRITER)
FLSA Status
EXEMPT
Reports To
MANAGER, WRITER INTEGRATION
Summary
Under the direction of the Sr. Director of Process Characterization/NPI, the Process Integration Engineer (Writer) is responsible for the process integration and characterization of prototype wafers for new technology programs and next generation projects, including performing wafer level process characterization, conducting failure analysis on prototype wafers and recommending corrective action, and reviewing, monitoring, and analyzing backend performance data. This position is located in Milpitas, California.
Essential Functions
Develops and delivers process integration and characterization techniques for new technology programs and next generation products
Conducts failure analysis on newly developed processes and recommends corrective action if necessary
Participates in characterization or integration projects of various scope and complexity; ensures they are completed within the established timeframe
Performs wafer level process characterization on thin film recording heads using Focused Ion Beam (FIB) tool to identify defects and recommends corrective action
Reviews and analyzes backend performance data and makes recommendations to improve performance
Designs and conducts experiments to verify process robustness; analyzes data and reports findings
Analyzes data using JMP, MS Visual Basic, or similar software application to determine the root cause of process variations; develops charts or reports and presents findings before groups or teams
Responds to inquiries from other team members, managers, or departments
Adheres to all safety policies and procedures as required
Performs other duties of a similar nature or level
Qualifications
Minimum Qualifications
Bachelor’s degree in Electrical Engineering, Materials Science, or Physics and/or equivalent relevant experience; Master’s or PhD degree preferred
Six years of hands‑on experience working in the process integration or characterization in a semiconductor environment in a manufacturing or process engineering role
Hands‑on experience using JMP or similar analytical application
Proficient in the use of Microsoft Office Applications
Required Knowledge, Skills, And Abilities
Knowledge of process integration and characterization principles, practices, and techniques
Knowledge of magnetic recording head or HDD manufacturing
Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
Able to design experiments, analyze results, and recommend corrective action
Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
Able to work productively and collaboratively with all levels of employees and management
Able to comply with all safety policies and procedures
Able to use critical thinking to resolve issues, conduct root cause analysis, and make recommendations for process improvements
Demonstrated analytical skills
Demonstrated organizational and time management skills
Demonstrated problem‑solving and troubleshooting skills
Flexible and able to prioritize
The annual rate for this full‑time position is between $121,000.00-160,000.00 + bonus target + benefits. Within the range the individual pay may differ depending on additional factors including job responsibilities, job related knowledge, skills, abilities, education, and experience. The annual pay range shown is subject to change and may be modified periodically.
Working Conditions
The Process Integration Engineer works primarily in an office environment from Monday thru Friday. The schedule may be altered from time‑to‑time to meet business or operational needs; may travel from building to building as needed. Also works in a class 100 ESD sensitive wafer manufacturing facility; wears a cleanroom (bunny) suit, including hood, gloves, safety glasses, booties, and mask. May be exposed to hazardous conditions, chemicals, fumes, and/or gases during the course of work day; may be exposed to loud noise. Stands, walks, bends, twists, and crawls. Performs various fine grasping movements; operates a computer and enters information using a keyboard, operates a telephone, and other office equipment; may occasionally push, pull, or lift up to 20 pounds.
Other duties of a similar nature or level are duties that may be required, but may not be specifically listed in the job description or posting.
TDK/Headway Technologies, Inc. provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, gender, national origin, age, disability, or genetics. Applicants requiring accommodation in order to complete the application process should contact the Headway Human Resources Department.
#J-18808-Ljbffr