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Silicon Packaging Design Engineer — Shape Next-Gen ICs

Intel Corporation, Phoenix, AZ, United States


A leading semiconductor manufacturer is seeking a Silicon Packaging Design Engineer in Phoenix, Arizona. The successful candidate will play a crucial role in the development of innovative packaging technologies, collaborating on design and troubleshooting challenges. They must hold a Bachelor's degree in electrical engineering, with a preferred background in CAD and layout design. This full-time role emphasizes strong analytical skills, and experience in scripting and custom layouts is valued. Competitive salary range offered with excellent benefits.
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