Senior Packaging Design Engineer – HBM/3D-IC Expert

A semiconductor firm seeks an experienced Senior Engineer to support the High Bandwidth Memory (HBM) packaging program. The role involves critical advanced packaging design responsibilities, collaborating with global teams. Ideal candidates will have a Master's or PhD in Electrical Engineering and over 5 years of relevant experience, including expertise in semiconductor design, die layout, and physical layout engineering. The position offers a competitive salary and opportunities for professional growth.
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