HBM & 3D-IC Die Design Lead

A leading memory and storage solutions company based in Boise, Idaho, is seeking a Die Design & Layout Manager. This experienced professional will lead the die design and layout engineering function, focusing on High Bandwidth Memory (HBM) packaging programs. You will manage a team, define design strategies, and ensure high-quality product integration for advanced applications in AI and data centers. A Master’s or PhD in Electrical Engineering is required, along with extensive experience in die design and advanced packaging methodologies.
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