Advanced Optical Packaging Design Tech Lead
PER International, San Jose, CA, United States
Advanced Optical Packaging Design Tech Lead
Location: San Jose, CA (4 days onsite)
We are partnering with a leading semiconductor company to hire an Advanced Optical Packaging Design Tech Lead to join a newly formed, high-impact engineering team focused on next-generation optical and optoelectronic systems.
This is a senior individual contributor role with significant technical ownership, focused on defining and delivering advanced packaging architectures for optical engines, silicon photonics products, and co-packaged optics platforms. The position sits at the intersection of package design, high-speed interconnects, and manufacturable system integration.
The Role
You will play a central role in defining package architecture and driving the development of advanced optical packaging solutions from concept through to production. This position requires deep technical expertise, strong cross-functional leadership, and the ability to operate at a senior staff / principal level.
Key responsibilities include:
Define package architecture and technology direction for advanced optical and optoelectronic products
Lead substrate design, including stack-up definition, routing topology, via strategy, impedance control, and manufacturability trade-offs
Drive electrical, mechanical, thermal, and optical co-design to achieve robust system performance
Lead development and integration of hybrid bonding solutions for fine-pitch die integration
Establish methodologies for warpage analysis, thermo-mechanical modeling, and package reliability
Own signal integrity strategy for high-speed package and substrate interconnects
Define scalable design rules and interconnect architectures across multiple product generations
Partner closely with IC, PIC, systems, packaging, reliability, and manufacturing teams to drive execution
Work with OSATs, foundries, and substrate suppliers to enable production-ready solutions
Lead root-cause analysis for performance, yield, and reliability issues
Mentor engineers and contribute to technical direction and engineering best practices
Requirements
Master’s or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field
10+ years of experience in advanced semiconductor or optoelectronic packaging
Strong experience in package architecture and substrate design
Hands-on experience with hybrid bonding technologies
Solid background in thermo-mechanical behavior, warpage analysis, and material interactions
Strong understanding of signal integrity for high-speed interconnects at the package/substrate level
Experience defining stack-ups, routing strategies, and design-for-manufacturability requirements
Proven track record of driving packaging solutions from concept through prototype, qualification, and production
Strong cross-functional leadership across design, reliability, manufacturing, and external partners
Preferred Experience
Silicon photonics, co-packaged optics, or optical module development
Optical assembly techniques (fiber attach, laser integration, photodiodes, alignment methods)
AI networking or high-speed interconnect hardware
Experience with tools such as Cadence APD/Allegro, ANSYS, HFSS, CST, COMSOL, or similar
2.5D / 3D integration, chiplets, or fine-pitch interconnect technologies
Experience working with OSATs, foundries, and substrate suppliers
Additional Information
This is a senior individual contributor role at a tech lead / principal level
Candidates must be willing to work onsite in San Jose 4 days per week
Relocation support is available
H1B transfer support is available
Why Apply?
This is an opportunity to join a newly established team and play a key role in shaping advanced optical packaging solutions for next-generation products. The role offers strong technical ownership, cross-functional influence, and the ability to impact both architecture and production execution in a high-performance engineering environment.
If you have deep experience in advanced packaging and are looking to work at the forefront of optical and high-speed interconnect technologies, this is a strong opportunity to step into a high-impact technical leadership role.
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Location: San Jose, CA (4 days onsite)
We are partnering with a leading semiconductor company to hire an Advanced Optical Packaging Design Tech Lead to join a newly formed, high-impact engineering team focused on next-generation optical and optoelectronic systems.
This is a senior individual contributor role with significant technical ownership, focused on defining and delivering advanced packaging architectures for optical engines, silicon photonics products, and co-packaged optics platforms. The position sits at the intersection of package design, high-speed interconnects, and manufacturable system integration.
The Role
You will play a central role in defining package architecture and driving the development of advanced optical packaging solutions from concept through to production. This position requires deep technical expertise, strong cross-functional leadership, and the ability to operate at a senior staff / principal level.
Key responsibilities include:
Define package architecture and technology direction for advanced optical and optoelectronic products
Lead substrate design, including stack-up definition, routing topology, via strategy, impedance control, and manufacturability trade-offs
Drive electrical, mechanical, thermal, and optical co-design to achieve robust system performance
Lead development and integration of hybrid bonding solutions for fine-pitch die integration
Establish methodologies for warpage analysis, thermo-mechanical modeling, and package reliability
Own signal integrity strategy for high-speed package and substrate interconnects
Define scalable design rules and interconnect architectures across multiple product generations
Partner closely with IC, PIC, systems, packaging, reliability, and manufacturing teams to drive execution
Work with OSATs, foundries, and substrate suppliers to enable production-ready solutions
Lead root-cause analysis for performance, yield, and reliability issues
Mentor engineers and contribute to technical direction and engineering best practices
Requirements
Master’s or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field
10+ years of experience in advanced semiconductor or optoelectronic packaging
Strong experience in package architecture and substrate design
Hands-on experience with hybrid bonding technologies
Solid background in thermo-mechanical behavior, warpage analysis, and material interactions
Strong understanding of signal integrity for high-speed interconnects at the package/substrate level
Experience defining stack-ups, routing strategies, and design-for-manufacturability requirements
Proven track record of driving packaging solutions from concept through prototype, qualification, and production
Strong cross-functional leadership across design, reliability, manufacturing, and external partners
Preferred Experience
Silicon photonics, co-packaged optics, or optical module development
Optical assembly techniques (fiber attach, laser integration, photodiodes, alignment methods)
AI networking or high-speed interconnect hardware
Experience with tools such as Cadence APD/Allegro, ANSYS, HFSS, CST, COMSOL, or similar
2.5D / 3D integration, chiplets, or fine-pitch interconnect technologies
Experience working with OSATs, foundries, and substrate suppliers
Additional Information
This is a senior individual contributor role at a tech lead / principal level
Candidates must be willing to work onsite in San Jose 4 days per week
Relocation support is available
H1B transfer support is available
Why Apply?
This is an opportunity to join a newly established team and play a key role in shaping advanced optical packaging solutions for next-generation products. The role offers strong technical ownership, cross-functional influence, and the ability to impact both architecture and production execution in a high-performance engineering environment.
If you have deep experience in advanced packaging and are looking to work at the forefront of optical and high-speed interconnect technologies, this is a strong opportunity to step into a high-impact technical leadership role.
#J-18808-Ljbffr