Substrate Packaging R&D Engineer for HV Manufacturing

Intel Corporation seeks a Substrate Packaging Research and Development Engineer based in Phoenix, Arizona. This full-time role focuses on optimizing high-volume manufacturing processes and equipment to enhance production efficiencies. Candidates should hold a Master’s or PhD in fields like Chemical Engineering or Material Science and possess at least three years of relevant experience. Key responsibilities include conducting tests, managing equipment maintenance, and leading improvement projects. Join Intel to impact semiconductor technology development.
#J-18808-Ljbffr