Production Assembly Operator

Job Overview – The Production Assembly Operator Operates Assembly and Test Equipment used in the Backend Assembly of Semiconductor components. This opportunity offers cross training and growth for individuals who excel. Responsibilities – Die Attach, Wire Bonding, Sealing, Laser Marking, RF-Testing, Packaging and Tape & Reel Loading /Unloading Equipment Operate/Run Production Equipment Microscope inspection Lifting <= 10lbs Enter Data in Database system Die Attach: Experience in Die Attach / Datacon Equipment preferred Bonding: Experience in Wire Bonding / H&K Equipment preferred RF Testing: Experience in Testing of IC’s / Automatic and/or Manual Testing All other operations: Experience Production Assembly preferred QUALIFICATIONS – 1 year experience in Assembly preferred (not required) Experience and ability to work in a fast-paced manufacturing environment. Must be able to work well with all levels of personnel whether individually or in a team environment. Open to work overtime including possible weekends Computer experience/operation necessary. The operator will work on a class 10k cleanroom environment Education – Hight School Diploma (Required)