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Senior HBM Physical Design Architect

Micron Technology, Inc, Boise, ID, United States


A leading semiconductor company is seeking a Principal Physical Design Architect located in Boise, Idaho. This role involves developing optimized floorplans, delivering block-level layouts, and collaborating with architects and circuit designers for next-generation High Bandwidth Memory (HBM) products. Ideal candidates should possess advanced knowledge in analog layout fundamentals and tools like Cadence VLE/VXL. They should have a strong background in memory-related layout or physical design with at least 5 years of experience. Competitive salary and robust benefits package are offered.
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