Avionics Packaging Engineer III - Spaceflight, Onsite 9x80

Lockheed Martin is seeking an experienced Electronics Packaging Engineer to work at the Englewood facility. You will collaborate closely with senior engineers to develop 3D concept models of avionics hardware for space flight. This role requires 3+ years of professional experience, expertise in electronic enclosure designs, and the ability to obtain a Top Secret clearance. Benefits include comprehensive medical and retirement plans. You'll work a flexible 9x80 schedule in a full-time onsite position.
#J-18808-Ljbffr