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ElectroMechanical Packaging Engineer III

Lockheed Martin, Englewood, CO, United States


Overview

The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and advance them for flight use. Location: This position does not support teleworking; you will be located near our Lockheed Martin Space facility in Littleton or Englewood CO and work a flexible 9x80 schedule in the office full-time.
Responsibilities

Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design review documentation and presentations.
Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
Establish specifications for contract assemblers and raw-material vendors. Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance.
Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment.
Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.
Key activities

Identify initial physical architecture for the Avionics subsystem.
Assist with R&D trade studies for Pre-SRR design phase.
Assist with defining the requirements and provide the framework for architecture and interface development & maintenance throughout the program lifecycle.
Generate and release design disclosure artifacts including technical presentations and end of year reports.
Work on a cross-functional team in the development and integration of world class avionics systems.
Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis.
Participate in iterative design reviews, EMRB hardware discrepancy decisions and FRB as required.
Resolve test anomalies and support system level testing.
To be effective in this role, you will need

Experience with electronic enclosure designs, performance and test requirements, and stress and thermal analysis.
3+ years professional experience.
DoD Top Secret clearance requirement and US Citizenship (initially no clearance needed to start, but must obtain and maintain).
Why Lockheed Martin?

Our employees play an active role in strengthening the quality of life where we live and work by volunteering more than 850,000 hours annually. Learn more about Lockheed Martin’s comprehensive benefits package. Find out more on how we proudly support Hiring Our Heroes.
Additional Information

Expression of Interest: By applying to this job, you are expressing interest in this position and could be considered for other career opportunities where similar skills and requirements have been identified as a match.
Ability to Work Remotely: Onsite Full-time: The work will be performed onsite at a Lockheed Martin facility.
Work Schedules: Lockheed Martin supports a variety of alternate work schedules; schedules range from standard 40 hours over five days to condensed schedules.
Schedule for this Position: 9x80 every other Friday off.
Pay Rate: See salary range disclosures.
Benefits offered: Medical, Dental, Vision, Life Insurance, Short-Term and Long-Term Disability, 401(k) match, etc. (full list in original)
Security Clearance Statement: This position requires a government security clearance; you must be a US Citizen for consideration. Clearance Level: Top Secret.
Legal and Compliance

Lockheed Martin is an equal opportunity employer. Qualified candidates will be considered without regard to legally protected characteristics.

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