ElectroMechanical Packaging Engineer II
Lockheed Martin, Englewood, CO, United States
Overview
The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and advance them for flight use. Location: This position does not support teleworking; you will be located near our Lockheed Martin Space facility in Littleton or Englewood, CO and be expected to work a flexible 9x80 schedule in the office full-time.
Responsibilities
Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design review documentation and presentations.
Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
Establish specifications for contract assemblers and raw-material vendors. Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance.
Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment.
Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.
Key Activities
Identify initial physical architecture for the Avionics subsystem.
Assist with R&D trade studies for Pre-SRR design phase.
Assist with defining the requirements and provide the framework for architecture and interface development & maintenance throughout the program lifecycle.
Generate and release design disclosure artifacts including technical presentations and end of year reports.
Work on a cross-functional team in the development and integration of world class avionics systems.
Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis.
Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions and Failure Review Board (FRB) as required.
Resolve test anomalies and support system level testing.
Qualifications
To be effective in this role, you will need
1+ years professional experience.
While no clearance is needed to start in this position, you will need to obtain and maintain a DoD Top Secret clearance; US Citizenship is required.
Basic Qualifications
Bachelor of Science or higher from an accredited college in Mechanical or Aerospace Engineering or related discipline, or equivalent experience/combined education.
Full working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T).
CAD modeling and drafting experience (CREO, SolidWorks and/or similar CAD data modeling experience, MBSE).
Willing and able to obtain and maintain a DoD Top-Secret clearance, US Citizenship required.
Desired Skills
Experience with CCA package design (IDX files, board outlines, connector selection, artwork review, component mounting, cooling techniques).
Working knowledge of EPDM tools or equivalent.
Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.).
Experience with 3D printing/prototyping.
Missile/Aerospace related experience.
Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint).
Familiarity with FBM specifications/procedures and with SP/SPF Customer Partners.
Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink).
MRB experience and ability to communicate issues and resource needs to leadership.
Experience with subcontracted hardware suppliers and tolerance stack-ups.
Demonstrated collaboration within a team and with adjacent disciplines, strong communication and presentation skills for technical and non-technical audiences.
Hands-on hardware experience.
Security Clearance Statement
This position requires a government security clearance; you must be a US Citizen for consideration. Clearance Level: Top Secret.
Other Important Information
Expression of Interest: By applying to this job, you are expressing interest in this position and could be considered for other openings with similar requirements. Onsite full-time work at a designated Lockheed Martin facility. Lockheed Martin supports a variety of alternate work schedules that provide additional flexibility. Schedule for this position: 9x80 every other Friday off.
Benefits and Additional Information
Why Lockheed Martin? Our employees contribute to volunteering and comprehensive benefits. Benefits include Medical, Dental, Vision, Life Insurance, Disability, 401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave, PTO, and Holidays. The application window will close in 90 days; applicants are encouraged to apply promptly for optimal consideration. Lockheed Martin is an equal opportunity employer.
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The Fleet Ballistic Missile Avionics team is seeking an experienced Electronics Packaging Engineer who will work closely with senior engineers to develop preliminary 3D concept models of space flight avionics hardware and advance them for flight use. Location: This position does not support teleworking; you will be located near our Lockheed Martin Space facility in Littleton or Englewood, CO and be expected to work a flexible 9x80 schedule in the office full-time.
Responsibilities
Support trade studies on electronic enclosure design approaches and provide technical data for informal and formal design review documentation and presentations.
Coordinate with thermal, dynamic, stress, reliability, EMC, and survivability analyses to assure compliant designs. Support manufacturing and test disciplines in minimizing cycle time and resolving electronic packaging problems.
Establish specifications for contract assemblers and raw-material vendors. Interface with Parts Engineering, Quality Assurance and Purchasing regarding material quality and vendor performance.
Provide producible designs that meet technical, cost, and schedule requirements, and work within an Integrated Product Team environment.
Prepare all applicable drawings and documentation needed for the fabrication and assembly of the hardware designed.
Key Activities
Identify initial physical architecture for the Avionics subsystem.
Assist with R&D trade studies for Pre-SRR design phase.
Assist with defining the requirements and provide the framework for architecture and interface development & maintenance throughout the program lifecycle.
Generate and release design disclosure artifacts including technical presentations and end of year reports.
Work on a cross-functional team in the development and integration of world class avionics systems.
Develop electronic enclosure designs, performance and test requirements, and stress and thermal analysis.
Participate in iterative design reviews, Engineering Material Review Board (EMRB) hardware discrepancy decisions and Failure Review Board (FRB) as required.
Resolve test anomalies and support system level testing.
Qualifications
To be effective in this role, you will need
1+ years professional experience.
While no clearance is needed to start in this position, you will need to obtain and maintain a DoD Top Secret clearance; US Citizenship is required.
Basic Qualifications
Bachelor of Science or higher from an accredited college in Mechanical or Aerospace Engineering or related discipline, or equivalent experience/combined education.
Full working knowledge and experience with Geometric Dimensioning and Tolerancing (GD&T).
CAD modeling and drafting experience (CREO, SolidWorks and/or similar CAD data modeling experience, MBSE).
Willing and able to obtain and maintain a DoD Top-Secret clearance, US Citizenship required.
Desired Skills
Experience with CCA package design (IDX files, board outlines, connector selection, artwork review, component mounting, cooling techniques).
Working knowledge of EPDM tools or equivalent.
Exposure to DFx Principles (Design for Affordability, Design for Manufacturability, etc.).
Experience with 3D printing/prototyping.
Missile/Aerospace related experience.
Proficiency in Microsoft Office Software (Word, Excel, MS Project, PowerPoint).
Familiarity with FBM specifications/procedures and with SP/SPF Customer Partners.
Experience with QNotes (SAP/ERP), PMP Database, FAST Items, DaSI, and FBM Web (Livelink).
MRB experience and ability to communicate issues and resource needs to leadership.
Experience with subcontracted hardware suppliers and tolerance stack-ups.
Demonstrated collaboration within a team and with adjacent disciplines, strong communication and presentation skills for technical and non-technical audiences.
Hands-on hardware experience.
Security Clearance Statement
This position requires a government security clearance; you must be a US Citizen for consideration. Clearance Level: Top Secret.
Other Important Information
Expression of Interest: By applying to this job, you are expressing interest in this position and could be considered for other openings with similar requirements. Onsite full-time work at a designated Lockheed Martin facility. Lockheed Martin supports a variety of alternate work schedules that provide additional flexibility. Schedule for this position: 9x80 every other Friday off.
Benefits and Additional Information
Why Lockheed Martin? Our employees contribute to volunteering and comprehensive benefits. Benefits include Medical, Dental, Vision, Life Insurance, Disability, 401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave, PTO, and Holidays. The application window will close in 90 days; applicants are encouraged to apply promptly for optimal consideration. Lockheed Martin is an equal opportunity employer.
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